APPLICATION FOR APPROVAL
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ARTICLE
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APPLICATION
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PERFORMANCE
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TEST METHOD
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6
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Tensile strength
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1)No visible damage
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Tensile strength:load:1.0kg.
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2)No breaking or looseing of
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Duration of load application:
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terminal
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60±5sec.
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Bending strength:load:0.5kg.
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The number of testing time:twice
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1)No open and short circuit
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Variable frequency cycle:
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7
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Vibration
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happened .
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10~55~10Hz/min
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2)No damage in element junction
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Amplitude 1.5 mm;Direction
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and appearance
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x,y,z;each direction 2 hours.
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At least 75% of the circumference
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Solder temperature:245±5℃
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8
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Solderability
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of the immersed shall be covered
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Dipping time:2±0.5 sec
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with new solder.
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Dipping depth:2±0.8mm from
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the root of the terminal.
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1)No visible damage;
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In 260±5°C solder bath
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9
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Resistance to
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2)Capacitance change:within ±5%
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for 5 sec
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solding heat
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of initial value.
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1)Capacitance change:ΔC/C≤5%;
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Test in constant thermostatic
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10
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Heat resistance
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2)The tangent of loss angle:
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oven after 2 hours deposit
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changed within 150% of initial
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reached temperatureequilibrum
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value at 1Khz
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85±2℃ thermostatic oven.
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3)IR≥30% of initial value
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1)Capacitance change:ΔC/C≤5%;
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Test in constant thermostatic
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11
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Cold resistance
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2)The tangent of loss angle:
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after 2 hours deposit
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changed within 150% of initial
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reached temperature equilibrum
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value at 1Khz
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-40±2℃ thermostatic oven.
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1)Appearance: no defect;
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Temp.:40°C;
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12
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Moisture resistance
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2)Test voltage:No defect,self
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Humidity:R.H 90%-95%
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healable ability is not destoryed;
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Add W.V for 240±8 hours
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3)Insulation resistance:≥30% of
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then keep the room temp.
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initial value;
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10 hours.
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4)The tangent of loss angle:change
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within 150% of initial value;
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5)Cap,change: ΔC/C≤5%
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1)Appearance:no defect;
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Add 140% of W.V.
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13
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Moisture
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2)Insulation resistance:≥50%
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85±3°C in Chamber for
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resistance
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of initial value;
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then keep .Under standerd
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loading
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3)The tangent of loss angle:
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1000H condition 2 hours.
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4)change within 150% of initial
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value;Cap,change: ΔC/C≤5%
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